Water cooler assembly and system

ABSTRACT

A heat transfer apparatus includes a first chamber horizontally offset from a second chamber to form an upper housing and a lower housing. The upper housing may be stacked on top of and fastened to the lower housing. The heat transfer apparatus may include a heat exchange interface fixed to a bottom surface of the lower housing. The heat exchange interface may absorb heat from a proximate heat source and transfer the absorbed heat to an inner surface of the lower housing. The apparatus includes a pump including an impeller and a stator disposed therein. The lower housing may separate the impeller from the stator so that the stator is isolated from the impeller by a surrounding casing. A liquid coolant may be circulated from an inlet, over the heat exchange interface and out to an outlet to remove heat from a processer proximate to the heat exchange interface.

BACKGROUND OF THE INVENTION Field of the Invention

The present disclosure relates generally to systems and apparatuses fortransferring computer processor generated heat from a heat exchangeinterface to a heat dissipating component. More specifically, thepresent disclosure relates to cooling a computer processing chip byplacing a cold plate adjacent to the chip and removing the heat from theheated cold plate by circulating a liquid coolant over an oppositesurface out to a radiator.

Description of the Related Art

Typical computer systems include heat-generating components that requirecooling. Central processing units (CPUs) and graphics processing units(GPUs) are the most common heat generating electrical components in acomputing device. Computer cooling systems are used to remove the wasteheat produced by CPUs and GPUs and other heat generating computercomponents.

Heat transfer systems may be used in computing devices to transfer heataway from these heat generating computer components to heat dissipatingcomponents. For example, some systems may utilize a combination of fansand fins for removing heat by convection. As another example, passiveheat exchangers exist that transfer heat generated by an electronic ormechanical device to a fluid medium to be dissipated away from thedevice.

The heat transfer processes preferably regulates the computing device'stemperature to maintain optimal levels. Regulating a computer'stemperature keeps computer components within permissible operatingtemperature limits.

Some computer cooling systems employ heat exchangers that transfer heatto a fluid coolant from a coolant reservoir, through fluid conduitsinterconnecting heat exchangers and the heat dissipating device, but theheat dissipating device may be in the form of a tubing coil and usesconvective heat transfer. Water cooling often adds a considerable degreeof complexity and cost to a design, with the cooling system requiring apump, tubing or piping to transport the water, and a radiator, oftenwith fans, to reject the heat to the atmosphere.

The desire for smaller, less-expensive and improved computing devicesdrives the need for new and improved configurations. Thus, there is aneed for new and improved cooling system for computing devices.

SUMMARY OF THE INVENTION

According to an embodiment of the present invention, a novel heattransfer apparatus is provided which includes an upper housing and alower housing. A cold plate may define a bottom surface of the lowerhousing. The heat transfer apparatus may also include a first chamberreservoir comprising a pump having an impeller and a stator. The pumpmay receive liquid coolant through an inlet in the upper housing andcirculate the liquid coolant through a second chamber reservoir that maybe in fluid communication with the first chamber reservoir. The firstchamber reservoir may be horizontally offset from the second chamberreservoir so that a liquid or gas medium may flow in through the inlet,through the first chamber reservoir, then through a channel to thesecond chamber reservoir, and out through the outlet, wherein thechannel may be configured to connecting the first chamber reservoir tothe second chamber reservoir. As the liquid coolant traverses the coldplate in the lower housing, the liquid coolant may absorb heat absorbedby the cold plate and emanating from the proximate computer processingchip. The heated liquid coolant may be transferred from the secondchamber reservoir to the radiator via an outlet offset from the inlet ofthe upper housing.

According to an embodiment of the present invention, a heat transferapparatus for a computer component may comprise an upper housing stackedon top of and fastened to a lower housing to form an enclosure. Theenclosure may include a first chamber horizontally offset from a secondchamber. The enclosure may also include a pump comprising an impellerdisposed within a stator, the impeller and stator may be disposed withinthe lower housing of the first chamber. The enclosure may also includean inlet disposed in a first aperture proximate to a center of the upperhousing and an outlet disposed in a second aperture horizontally offsetfrom the center of the upper housing, wherein the inlet may be in fluidcommunication with the pump in the first chamber and the outlet may bein fluid communication with the second chamber. The enclosure mayfurther include a cold plate fixed to a bottom surface of the lowerhousing and the second chamber, wherein the cold plate may be configuredto transfer heat from an adjacent heat source into the second chamber.

According to embodiments of the present invention, a heat transferapparatus may further include a fan fixture removably secured to theupper housing. The fan fixture may comprise a first opening to receivethe inlet and a second opening to receive the outlet. The fan fixturemay also include a fan horizontally offset from the first opening andthe second opening, wherein the fan, when energized circulates airthroughout the immediate environment. The impeller of the heat transferapparatus may include impeller blades arranged uniformly around a topsurface of the impeller and extending out from a shaft fixed at a centerof the impeller. The impeller may further include a magnet ring disposedwithin the inner structure of the impeller such that the impeller ispartially secured around a shaft within the stator by a magnetic fieldgenerated by the magnetic ring. The second chamber may be definedbetween the lower housing and the cold plate, wherein the second chambermay be in fluid communication with the first chamber via at least onepassageway offset from a center of the impeller.

According to an embodiment of the present invention, a system forcooling a central processor within a computing device may include a heattransfer apparatus that may include a housing defined by an upperportion stacked upon and fastened to a lower portion to form a firstchamber horizontally offset from a second chamber. The heat transferapparatus may further include a reservoir disposed within the firstchamber and the second chamber, wherein the reservoir may include aplurality of channels configured to allow fluid communication from thefirst chamber to the second chamber. The heat transfer apparatus mayfurther include a pump having an impeller disposed within the firstchamber defined between the upper portion and the lower portion, whereinthe pump may further include a stator disposed directly beneath thefirst chamber. The heat transfer apparatus may further include a heatexchange interface that may be fixed to a bottom portion of the housingto define a bottom surface of the housing, wherein a top surface of thecomputer processor may be coupled to or adjacent to a bottom surface ofthe heat exchange interface of the heat transfer apparatus.

According to an embodiment of the present invention, the heat transferapparatus of the system may further include an inlet disposed in a firstaperture proximate to a center of the upper portion of the housing,wherein the inlet may be in fluid communication with the first chamber.The heat transfer apparatus of the system may further include an outletdisposed in a second aperture offset from the center of the upperportion of the housing, wherein the outlet may be in fluid communicationwith the second chamber. The heat transfer apparatus of the system mayfurther provide for the plurality of channels to be offset from a centerof the impeller. The heat exchange interface of the system may beconfigured to absorb heat therein and transfer the heat to a liquidcoolant that may pass over the heat exchange interface. The liquidcoolant may be configured to absorb the heat and flow through the outletand out to a heat dissipating device. The lower portion may beconfigured to separate the impeller from the stator to isolate thestator from the impeller.

According to an embodiment of the present invention, a method forcooling a heat generating computer component may include receiving aliquid coolant into a housing; transferring the liquid coolant to a pumpcomprising an impeller and a stator, wherein the pump may be disposed ina first chamber of the housing. The first chamber may be defined betweenan upper portion and a lower portion of the housing. The method mayfurther include transferring the liquid coolant from the pump to asecond chamber horizontally offset from the first chamber of thehousing, wherein the second chamber may include a heat exchangeinterface affixed to a first bottom surface of the second chamber, andwherein the first bottom surface may substantially define a secondbottom surface of the housing; and traversing the liquid coolant overthe heat exchanging interface and out from the second chamber.

According to an embodiment of the present invention, the method mayinclude receiving the liquid coolant may further include receiving theliquid coolant into an inlet of the upper portion of the housing;traversing the liquid coolant out from the second chamber through anoutlet of the upper portion of the housing, wherein the outlet may be influid communication with the second chamber. The method may furtherinclude absorbing, at least by the liquid coolant, heat from the heatexchange interface to reduce a temperature of the heat exchangeinterface; transferring the liquid coolant from the pump to the secondchamber via a plurality of passageways that are offset from a center ofthe impeller; transferring the liquid coolant to a heat dissipatingdevice in fluid communication with the outlet; and circulating airthroughout the immediate environment of the housing.

BRIEF DESCRIPTION OF DRAWINGS

Embodiments of the present invention are illustrated by way of examplewith reference to the accompanying drawings, which should not beconstrued to limit the present disclosure.

FIG. 1 illustrates a side view of a heat transfer apparatus, accordingto an example embodiment.

FIG. 2 illustrates a cross-sectional view of a heat transfer apparatus,according to an example embodiment.

FIG. 3 illustrates a top view of a heat transfer apparatus, according toan example embodiment.

FIG. 4 is a cross-sectional top view of a heat transfer apparatus,according to an example embodiment.

FIG. 5 is a flow diagram showing a method for transferring heat from aprocessor, according to an example embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Described in detail herein are apparatuses, systems, and methods forcooling a processor. Exemplary embodiments provide for providing anenclosure including an upper housing and a lower housing to receive aliquid coolant in an inlet of the upper housing and to transfer heatedliquid coolant from an outlet of the upper housing to a heat dissipatingdevice. Exemplary embodiments further provide an impeller and statordisposed within a first chamber reservoir to define a pump that receivesand transfers the liquid coolant from the first chamber reservoir to ahorizontally offset second chamber reservoir. The second chamberreservoir may include a bottom surface that substantially defines a heatexchange interface (or cold plate). The heat exchange interface may bepositioned adjacent to or proximate to a computer processor, wherein theheat exchange interface absorbs heat generated by the computerprocessor. The absorbed heat may then be transferred to the liquidcoolant as it passes over the heat exchange interface proximate to abottom surface of the second chamber reservoir. Further exampleembodiments provide for transferring the heated liquid coolant out thesecond chamber reservoir though an outlet affixed to the upper housing.

The apparatuses described herein can provide a heat transfer deviceusing a liquid coolant medium. The heat transfer apparatus may include ahousing that may be defined by an upper housing (or upper portion)secured to a lower housing (or lower portion). Further, the heattransfer apparatus may include a first chamber reservoir horizontallyoffset from a second chamber reservoir. The heat transfer apparatus mayfurther include a pump having an impeller and a stator. The impeller maybe disposed within the first chamber that may be defined between theupper housing and the lower housing. The stator may be disposed directlybeneath the first chamber, wherein the lower housing may separate theimpeller from the stator so that the stator can be isolated from theimpeller. The second chamber may be defined between the lower housingand the heat exchange interface (or cold plate), wherein the secondchamber may be in fluid communication with the first chamber viapassageways. The passageways may be configured to be offset from acenter of the impeller.

The heat transfer apparatus may be fastened to a computing deviceprocessor (e.g. computer processing unit (CPU), graphics processing unit(GPU)) or any other heat generating device such that the heat exchangeinterface is physically contacting the computing device processor. Thefirst chamber may receive a liquid coolant, which may be chilled or at atemperature below a predetermined threshold, and circulate the liquidcoolant via the impeller through the passageways and into the secondchamber. An inlet may be affixed to a first opening proximate to thecenter of the upper housing. An inlet may be affixed to the upperhousing and configured to receive a heat-transfer medium and supply theheat-transfer medium to a reservoir or the first chamber. The inlet maybe positioned at any location of the upper housing so long as the inletwill be in fluid communication with the reservoir or the first chamberto provide the heat-transfer medium to the pump in the first chamber.

The liquid coolant that enters the second chamber may be dispersed alongchannels that may be formed in the upper surface of the heat exchangeinterface.

As the liquid coolant traverses the heat exchange interface, the liquidcoolant absorbs heat conducted from the computing device processor. Theheated liquid coolant may then be directed through an outlet that may beformed in the upper housing. The outlet may be in fluid communicationwith a heat dissipating device, which may receive the heated liquidcoolant to return to a lower temperature. In other words, the heatedliquid coolant may be transferred out from the second chamber through anoutlet in the upper housing for cooling at a heat dissipation device.The outlet may be positioned at any location of the upper housing solong as the outlet will be in fluid communication with the reservoir orthe second chamber to receive the heat-transfer medium from anddisbursement out of the second chamber.

Referring to FIG. 1, according to an embodiment of the presentinvention, a heat transfer apparatus 100 may include an upper housing102 which may be stacked on top of and fastened to a lower housing 104to form a first chamber 110 horizontally offset from a second chamber120. The first chamber 110 may be horizontally offset from the secondchamber 120 such that the first chamber 110 and the second chamber 120form a dual chambered lateral enclosure secured by the upper housing 102and the lower housing 104. The first chamber 110 may also be slightlyelevated above the second chamber 120. Such slight elevation may allowfor gravity to assist in the flow of a fluid from the first chamber intothe second chamber. The chambers may be offset in other arrangements tosatisfy the design parameters. For example, the second chamber 120 maybe slightly elevated above the first chamber 110 while still beinghorizontally offset from each other.

The heat transfer apparatus 100 may also include a heat exchangeinterface 130 (or cold plate) that may be fixed to a bottom surface ofthe lower housing. The heat exchange interface 130 may also bepositioned at the lowest center of the heat transfer apparatus 100and/or may be fixed between the first chamber 110 and the second chamber120. The heat exchange interface 130 may be configured to absorb heatfrom a proximate heat generating device or heat source and transfer theabsorbed heat to an inner surface of the lower housing. The heatexchange interface 130 may include fins (not shown) to improve heattransfer by either creating turbulent flow and reducing thermalresistance or increasing fin density to increase the heat transfer area,as known to one of ordinary skill in the art.

The second chamber 120 may be positioned between the heat exchangeinterface 130 and the upper housing 102, such that the lower housing 104may form a wall or exterior boundary of the second chamber 120. In otherwords, a bottom portion of the lower housing 104 may form a partialbarrier between the cold plate and the second chamber 120. However, thebottom portion of the lower housing 104 may include an openingcomprising fins to allow fluid or air communication from an innersurface of the heat exchange interface 130 (cold plate) into the secondchamber 120. The fins may be arranged in any manner to allow any mediumto flow there through. For example, the fins may louvered, lancedoffset, wavy, or straight. Fins improve heat transfer in two ways. Oneway is by creating turbulent flow through fin geometry, which reducesthe thermal resistance (the inverse of the heat transfer coefficient)through the nearly stagnant film that forms when a fluid flows parallelto a solid surface. A second way is by increasing the fin density, whichincreases the heat transfer area that comes in contact with the fluid.Fin geometries and densities that create turbulent flow and improveperformance also increase pressure drop, which is a critical requirementin most high performance applications. The optimum fin geometry and findensity combination is then a compromise of performance, pressure drop,weight, and size. Aside from fin geometry, parameters such as thickness,height, pitch, and spacing can also be altered to improve performance.Typically, fin thicknesses vary from 0.004 in (0.1 mm) to 0.012 in (0.3mm), heights vary from 0.035 in (0.89 mm) to 0.6 in (15.24 mm), anddensities vary from 8 to 30 FPI (Fins per Inch).

In another example embodiment, the heat transfer apparatus 100 may beconfigured such that the second chamber 120 may be defined between thelower housing and the heat exchange interface 130 or cold plate 130. Thesecond chamber 120 may be in fluid communication with the first chamber110 via a plurality of passageways. The plurality of passageways may beoffset from a center of the impeller 140.

In another example embodiment, the heat transfer apparatus 100 mayinclude an inlet 112 affixed to a first opening or first aperture of theupper housing 102. The first opening may be proximate to a center of theupper housing, wherein the inlet 112 may be configured to receive aheat-transfer medium from an external source. The heat-transfer mediummay be a liquid coolant, gas coolant, or any other type of heatabsorbing medium known to those of ordinary skill in the art. The heattransfer apparatus 100 may be configured to allow the heat-transfermedium to flow into a reservoir that is in fluid communication with theinlet 112. The reservoir may be defined by a first chamber 110 and asecond chamber 120, wherein the first chamber 110 may be alignedhorizontally offset from the second chamber 120. In other words, thefirst chamber 110 may be horizontally aligned with the second chamber120 such that the first chamber 110 is not positioned vertically abovethe second chamber 120, although the first chamber 110 may be slightlyelevated above the second chamber 120.

In another example embodiment, the heat transfer apparatus 100 may beconfigured such that the impeller (not shown, but internal to the lowerhousing) may be disposed in the first chamber 110 and positioned betweenthe upper housing 102 and the lower housing 104. The upper housing 102may substantially include the first chamber 110 and the lower housing104 may substantially include the second chamber 120. The stator (notshown) may be disposed entirely within the lower housing 104 andconfigured to receive the impeller within a groove shaped and sized inaccordance with the shape and size of the impeller. By the nature of theimpeller and the stator being disposed within the lower housing 104, thestator may also be disposed directly beneath or underneath the firstchamber 110. The upper housing 102 may include an aperture or slot toreceive a shaft of the impeller to secure the impeller shaft in place toreduce vertical movement of the shaft when in motion, as will bedescribed further herein.

In another example embodiment, the heat transfer apparatus 100 mayinclude a fan fixture 150 which may be removably secured to the upperhousing 102. The fan fixture may include a first opening to receive theinlet 112 and a second opening to receive the outlet 114. The fanfixture 150 may also include a fan 152 horizontally offset from thefirst opening and the second opening, but fixed within the same uniformbody of the fan fixture 150. The fan 152 may be configured to circulateair throughout the immediate environment internal and external to theheat transfer apparatus 100. The fan 152 may be powered by any externalpower source to the heat transfer apparatus 100 or powered by a powersource made available to the heat transfer apparatus 100.

In an example embodiment, as illustrated in FIG. 2, a system for coolinga processor may include a heat transfer apparatus 200 embodied by ahousing defined by an upper portion stacked upon and fastened to a lowerportion to form a first chamber 210 horizontally offset from a secondchamber 220. A reservoir may be defined within the first chamber 210 andthe second chamber 220, wherein the reservoir may include a plurality ofchannels throughout which may be configured to allow fluid communicationfrom the first chamber 210 to the second chamber 220. The plurality ofchannels may be configured to be offset from a center of the impeller242.

The heat transfer apparatus 200 may further include a pump 240 that mayinclude an impeller 242 and a stator 244 disposed within the pump 240.The lower housing 220 may be configured to separate the impeller 242from the stator 244 so that the stator 244 is isolated from the impeller244. For example, the impeller 242 may be configured to fit within in acavity of an upper section of the first chamber 210 but also secured tothe lower housing by a shaft 246. The impeller 242, when secured to thelower housing 204, may be configured to occupy the area around the upperand surrounding interior walls of the first chamber 210. The lowerhousing may be positioned to separate the first chamber 210 from thestator 244, thereby allowing access to the stator from the bottom of theenclosure. The stator 244 may be secured to a bottom surface of thelower housing 204 and configured to receive the impeller 242 around atop portion of the stator 244. The stator 244 may be isolated from thefirst chamber 210 by a surrounding casing, but secured at its center tothe lower housing 202 by an axial portion. The axial portion may beconfigured to receive one end of the shaft 246 such that, when received,the shaft 246 secures the impeller 242 to surrounding casing of thestator 244. The shaft 246 may also be fixed to the impeller 242 suchthat when the shaft 246 rotates, the impeller 242 rotatesproportionally. In this configuration, the impeller 244 is free torotate about the shaft 246 when an energy force is applied thereto. Whenthe impeller 246 rotates about the shaft 246, it also rotates about thestator 242, although the stator is isolated from the impeller 242 by thesurrounding casing of the stator 242. Alternatively, the shaft 246 maybe fixed to its foundation secured in the housing such that the impeller242 only rotates around the fixed shaft 246.

The pump 240 of the system for cooling a processor may also provide foran impeller 242 to be disposed within the first chamber 210 that may bedefined between the upper portion and the lower portion of the housing.The pump 240 may also include the stator 244 that may be disposeddirectly beneath the first chamber. The lower portion may be configuredor arranged to separate the impeller 242 from the stator 244 to isolatethe stator 244 from the impeller 242. The stator 244 may be isolatedfrom the first chamber 210 by a surrounding casing as described aboveherein.

The system of this example embodiment may further provide for theimpeller 242 to be disposed in the first chamber 210 and positionedbetween the upper housing 202 and the lower housing 204. The upperhousing 202 may substantially include the first chamber 210 and thelower housing 204 may substantially include the second chamber 220. Thestator 244 may be disposed entirely within the lower housing 204 andconfigured to receive the impeller 242 within a groove shaped and sizedin accordance with the shape and size of the impeller 242. By the natureof the impeller 242 and the stator 244 being disposed within the lowerhousing 204, the stator 244 may also be disposed directly beneath orunderneath the first chamber 210. The upper housing 202 may include anaperture or slot to receive a shaft 246 of the pump 240 to secure theimpeller shaft in place to reduce vertical movement of the shaft 246when in motion.

The system for cooling a processor may also include a heat exchangeinterface 230 that may be affixed to a bottom portion of the housing toform a part of a bottom surface of the housing. The heat exchangeinterface 230 may also be affixed to a bottom surface of the secondchamber 220 such that a top surface of the heat exchange interface 230is exposed to the second chamber 220 reservoir and a bottom surface ofthe heat exchange interface 230 may be proximate to or adjacent to anexternal surface of the housing or an external surface of the secondchamber 220. Alternatively, the heat exchanging surface 230 may bedisposed beneath a bottom surface of the second chamber 220 or secondchamber of the reservoir. The heat exchanging interface 230 may formpart of the bottom surface of the second chamber 220 and may include anopening, comprising fins, to allow fluid or air communication from aninner surface of the heat exchange interface 230 into the second chamber220.

The impeller 242 may include impeller blades and a magnet ring fixed toa core of the impeller. The magnet ring may be disposed within the innerstructure of the impeller 242 such that the impeller blades fan out fromthe magnet ring. However, the magnet ring may be a separate structurefrom the impeller blades but still form the impeller 242 as a singleunit. The impeller 242 may be fixed in an upward or downwardorientation. Also, the impeller 242 may be positioned above, below or invertical alignment with the stator 244. However, the impeller 242 may bealigned with the same planar axis as the stator 244 to allow impeller242 movement substantially within the stator 244.

The system for cooling a processor may further include a computingdevice processor, wherein a top surface of the computer processor may becoupled to or adjacent to a bottom surface of the heat exchangeinterface 230 of the heat transfer apparatus 200. The computing deviceprocessor may be a central processing unit (CPU), graphical processingunit (GPU) or any other computing device that is known to those ofordinary skill in the art to generate heat.

The system for cooling a processor may also include an inlet 212disposed in a first aperture proximate to a center of the upper portionof the housing of the heat transfer apparatus 200. The inlet 212 may bepositioned at any location in the upper portion of the housing suchthat, when the inlet 212 receives water, the water may be guided aroundthe center of the impeller 242 or to the second chamber 220. The inlet212 may be configured to be in fluid communication with the firstchamber 210. The inlet 212 may also be in fluid communication with thepump 240 to allow a liquid or gas medium to flow from an opening in afirst end of the inlet 212 to the aperture of the upper portion of thehousing. The inlet 212 into the first chamber 210 may be always beconfigured to allow fluid communication into the center of the impeller242. However, the inlet 212 may be in fluid communication with a channelthat eventually leads up to the center of the impeller 242.

The system for cooling a processor may also include an outlet 214disposed in a second aperture offset from the center of the upperportion of the housing of the heat transfer apparatus 200. The outlet214 may be configured to be in fluid communication with the secondchamber 220. The outlet 214 may be configured to transfer liquid coolantfrom the second chamber 220 to a radiator or heat dissipating device.The second chamber 220 may be configured to receive the liquid coolantfrom the first chamber 210 and direct a flow of the liquid coolant overthe internal surface of the heat exchange interface 230. Further, thesecond chamber 220 may be configured to further direct the flow of theliquid coolant from the heat exchange interface 230 internal surface andthrough a distal opening in the outlet 214. The outlet 214 may beconfigured to always be on the side of or horizontally offset from theimpeller 242. There may be at least one or more outlets which may guidethe water into separate channels or into one channel.

The heat exchange interface 230 may be configured to absorb heatgenerated from the proximal heat generating computing processing device.The heat exchange interface 230 may also be configured to transfer theabsorbed heat to a liquid coolant that traverses an internal surface ofthe heat exchange interface 230, wherein the internal surface is withinthe second chamber 220 of the reservoir. The internal surface mayinclude a plurality of grooves or channels that permit directional flowof the liquid coolant towards the outlet 214. The second chamber 220 maybe in fluid communication with the first chamber 210 via passageways orchannels that may be offset from a center of the impeller.

The heat exchange interface 230 may be configured to absorb heat thereinand may be configured to transfer the heat to a liquid coolant thattraverses or passes over the internal surface of the heat exchangesurface. The liquid coolant may be configured to absorb the heat anddirect the liquid coolant to flow through the outlet 214. Once theliquid coolant has passed through the outlet 214, the liquid coolant maybe directed to a heat dissipating device. The heat dissipating devicemay be a radiator, heat sink or any other device known to those ofordinary skill in the art to receive a heat containing medium andtransfer heat from that medium to another medium, thereby removing theheat from the liquid coolant.

According to another example embodiment, a heat transfer apparatus 300is shown in FIG. 3. The heat transfer apparatus 300 may include a firstchamber 310 horizontally offset from a second chamber 320. The heattransfer apparatus 300 may also include an upper housing stacked on topof and fastened to a lower housing to define an enclosure for the heattransfer apparatus 300. The heat transfer apparatus 300 may also includea heat exchange interface (or cold plate)—not shown—that may be fixed toa bottom surface of the lower housing. The heat exchange interface maybe configured to absorb heat from a proximate heat generating device orheat source and transfer the absorbed heat to an inner surface of thelower housing. The heat transfer apparatus 300 may further include apump 340 that may include an impeller—not shown—and a stator—notshown—disposed within the pump 340. The lower housing may be configuredto separate the impeller from the stator so that the stator is isolatedfrom the impeller. For example, the impeller may be positioned in anupper section of the upper housing and the stator may be secured towithin a lower section of the lower housing, as described above herein.The lower housing may be positioned to separate the first chamber 310from the stator via a surrounding casing of the stator, thereby allowingaccess to the stator from the bottom of the enclosure.

In another example embodiment, the heat transfer apparatus 300 may beconfigured such that the second chamber 320 may be defined between thelower housing and the heat exchange interface 330 or cold plate 330. Thesecond chamber 320 may be in fluid communication with the first chamber310 via a plurality of passageways. The plurality of passageways may beoffset from a center of the impeller 340, but eventually ultimatelymaintain fluid communication with the impeller 340.

In another example embodiment, the heat transfer apparatus 300 mayinclude an inlet 312 affixed to a first opening or first aperture of theupper housing. The first opening may be proximate to a center of theupper housing, wherein the inlet 312 may be configured to receive aheat-transfer medium from an external source. The heat-transfer mediummay be a liquid coolant, gas coolant, or any other type of heatabsorbing medium known to those of ordinary skill in the art, asdescribed above. The heat transfer apparatus 300 may be configured toallow the heat-transfer medium to flow into a reservoir that is in fluidcommunication with the inlet 312. The reservoir may be defined by afirst chamber 310 and a second chamber 320, wherein the first chamber310 may be horizontally offset from the second chamber 320.

In another example embodiment, the heat transfer apparatus 300 mayinclude an outlet 314 affixed to a second opening or second aperture ofthe upper housing. The second opening may be horizontally offset fromthe center of the upper housing and the first opening, wherein theoutlet 314 may be configured to transfer the heat-transfer medium fromthe pump 340 somewhere external to the heat transfer apparatus 300. Theheat transfer apparatus 300 may be configured to allow the heat-transfermedium to flow out of the reservoir that is in fluid communication withthe outlet 314.

In another example embodiment, the heat transfer apparatus 300 may beconfigured such that the impeller 342 may be disposed in the firstchamber 310 defined between the upper housing and the lower housing. Theupper housing may substantially include the first chamber 310 and thelower housing may substantially include the second chamber 320. Thestator 344 may be disposed directly beneath or underneath the firstchamber 310.

According to another example embodiment, a heat transfer apparatus 400is shown in FIG. 4. The heat transfer apparatus 400 may include a secondchamber, wherein the first chamber—not shown—may be stacked on top ofand fastened to the second chamber 420 to define an upper housing and alower housing. The heat transfer apparatus 400 may also include a heatexchange interface 430 (or cold plate) that may be fixed to a bottomsurface of the lower housing. The heat exchange interface 430 may beconfigured to absorb heat from a proximate heat generating device orheat source and transfer the absorbed heat to an inner surface of thelower housing. The heat transfer apparatus 400 may further include apump 440 that may include an impeller 442 and a stator 444 disposedwithin the pump 440. The lower housing 420 may be configured to separatethe impeller 442 from the stator 444 so that the stator 444 is isolatedfrom the impeller 442, as described above herein. The pump 440 may alsoinclude electric circuitry configured to energize the pump and itscomponents according to the needs of the computing device of which theheat transfer apparatus 400 may serve.

The impeller 442 may include impeller blades 448 and a magnet ring (notshown). The magnet ring may be disposed within the inner structure ofthe impeller 442 such that the impeller blades 448 fan out from themagnet ring. However, the magnet ring may be a separate structure fromthe impeller blades 448 but still form the impeller 442 as a singleunit. The impeller 442 may be fixed in an upward or downwardorientation. Also, the impeller 442 may be positioned above, below or invertical alignment with the stator 444. However, the impeller 442 may bealigned with the same planar axis as the stator—not shown—to allowimpeller 442 movement substantially within the stator.

In another example embodiment, the heat transfer apparatus 400 may beconfigured such that the second chamber may be defined between the lowerhousing and the heat exchange interface 430 or cold plate 430. Thesecond chamber may be in fluid communication with the first chamber viaa plurality of passageways 450. The plurality of passageways 450 may beoffset from a center of the impeller 442.

In another example embodiment, the heat transfer apparatus 400 mayinclude an inlet affixed to a first opening or first aperture of theupper housing. The first opening may be proximate to a center of theupper housing, wherein the inlet may be configured to receive aheat-transfer medium from an external source. The inlet may be positionto be directly above the shaft 446 such that the heat-transfer mediummay flow through the inlet and into the pump where the shaft 446 ispositioned. The heat-transfer medium may be a liquid coolant, gascoolant, or any other type of heat absorbing medium known to those ofordinary skill in the art, as described above. The heat transferapparatus 400 may be configured to allow the heat-transfer medium toflow into a reservoir that is in fluid communication with the inlet. Thereservoir may be defined by a first chamber and a second chamber,wherein the first chamber may be offset from the second chamber.

In another example embodiment, the heat transfer apparatus 400 mayconfigured such that the impeller 442 may be disposed in the firstchamber defined between the upper housing and the lower housing. Theupper housing may substantially include the first chamber and the lowerhousing may substantially include the second chamber. The stator may bedisposed directly beneath or underneath the first chamber.

In this example embodiment, the pump 440, when energized, may beconfigured to pull water in above the impeller 442 toward the center ofthe impeller 442, then accelerate the water with the impeller blades448. The impeller blades 448 may be configured to rotate in a clock-wiseor counter-clock-wise direction, thereby changing the direction ofaccelerating the water correspondingly. Further, the impeller blade 448angles and accompanying centrifugal force applies a proportional forceto the water to force the water outward and through one or several ofthe channels 450. If the water flows from the first chamber to thesecond chamber, the channels 450 may lead separately or combined intothe second chamber. If the water flows from the first chamber to thesecond chamber, then the channels outside the impeller 442 may guide thewater to a nozzle which may be connected to a hose.

In another example embodiment, the pump 440 may be configured to pullwater in above the impeller 442 to the center of the impeller 442, thenaccelerate the water with the impeller blades 448 and outwards into thechannels 450. The channels 450 may then guide the water to the entranceof the second chamber 460 from where it enters the channels formed bythe fins or grooves 470 of the cold plate 430. From there, the water maythen flow along the guides in the lower housing of the first chamber.Once the water is in the lower housing of the second chamber, the watermay be forced to flow up through the outlet of the upper housing and outof the enclosure.

The shaft 446 may be configured to be fixed to the impeller 442 and bedisposed within a groove in the upper housing to hold the shaft 446 inposition. The shaft 446 may need to be held in position due to a lowpressure zone created by the pump 440, which creates an uplift to theimpeller 442. By fixing the shaft 446 to the impeller 442, the shaft 446is supported to withstand the low pressure zone and force applied to theimpeller 442. This may reduce the noise and friction that may be createdby the effects of the low pressure zone within the pump 440 of the heattransfer apparatus 400. The impeller 442 may also include a bearing andthe shaft 446 may be fixed to the lower housing. By fixing the shaft 446to the lower housing, the impeller 442 may be held in position by amagnet or a washer.

In yet an example embodiment, a method for cooling a processor isdescribed. The method 500 may include receiving 510 a liquid coolantinto a housing. The liquid coolant may be received into the housing viaan inlet in fluid communication with a first chamber in the housing. Themethod 500 may further include transferring 520 the liquid coolant to apump having an impeller and a stator disposed in the first chamber ofthe housing.

The method 500 may further include transferring 530 the liquid coolantfrom the pump or the first chamber to a second chamber offset from thefirst chamber of the housing. The method 500 may further includetraversing the liquid coolant through the second chamber and over a heatexchange interface proximate to a computer processor. The method 500 mayfurther include transferring the liquid coolant to a heat dissipatingdevice through an outlet in fluid communication with the second chamberof the housing.

In another example embodiment, the method 500 may further includereceiving the liquid coolant into an inlet of the upper portion of thehousing. The method 500 may also include traversing the liquid coolantout from the second chamber through an outlet of the upper portion ofthe housing, wherein the outlet is in fluid communication with thesecond chamber. When traversing the liquid coolant over the heatexchange interface, the liquid coolant may absorb heat from the heatexchange interface, thereby reducing a temperature of the heat exchangedevice.

The method 500 may further include transferring the liquid coolant fromthe pump to a second chamber via the second chamber via at least onepassageway that may be offset from a center of the impeller. The atleast one passageway may also be in alignment with the center of theimpeller or may be arranged in another configuration that allows theliquid coolant to flow throughout the reservoir. In other words, the atleast one passageway is not limited to be offset from the center of theimpeller, but may be arranged otherwise to allow fluid communicationbetween the first chamber and the second chamber.

The method 500 may further include transferring the liquid coolant to aheat dissipating device that may be in fluid communication with theoutlet.

In another example embodiment, a method for cooling a processor byremoving heat from its components may include receiving a liquid coolantinto a housing, transferring the received liquid coolant to a secondchamber having a heat exchange interface attached to a bottom surface ofthe second chamber, traversing the liquid coolant through the secondchamber and over the heat exchange interface proximate to a computerprocessor. The method may further include transferring the liquidcoolant from the second chamber through one or more passages to a firstchamber positioned about the center of pump having an impeller andstator. The method may further include transferring the liquid coolantfrom the impeller to an outlet extending through an aperture in an uppersurface of the first chamber, wherein the outlet provides fluidcommunication to a heat dissipating device. In other words, in thismethod, the liquid coolant may flow in an opposite direction and in theopposite manner in which the liquid coolant flows described in method500 above.

Alternatively, the inlet and outlet may be extended through an aperturein the lower housing, wherein the inlet may be configured to receive aliquid coolant for distribution throughout the reservoir and the outletmay be configured to expel the liquid coolant out from the reservoir toa heat dissipation device. The particular positions of the inlet andoutlet are not necessarily fixed and may be placed at any location solong as the inlet and outlet perform the functions as described here.For example, the inlet may be configured to bring water about the centerof the impeller of the first chamber, or bring water about the center ofthe impeller of the second chamber if reverse flow is the designed flow.

As another alternative embodiment, the internal components of the heattransfer apparatus may be positioned in reverse of the embodimentsdescribed above herein. For example, the impeller can be positioned suchthat the impeller blades are facing down within the reservoir. In thisconfiguration, the upper casing may be configured to separate theimpeller and magnet from the stator.

Also, the heat transfer apparatus may be configured to allow the liquidcoolant to flow in a direction that is opposite to the flow directiondescribed above herein. For example, the liquid coolant may be providedinto the outlet and transferred to the second chamber, then through thefirst chamber, and out through the inlet. In this example embodiment,the liquid coolant would still flow over the cold plat and then to thepump in the first chamber. Nonetheless, the first chamber may still behorizontally offset from the second chamber as described above herein.

The following description is presented to enable any person skilled inthe art to create and use apparatuses, systems and methods describedherein provide for cooling a processor using a dual-chamber coolingliquid circulation device. The relative motion of the blades to thefluid adds velocity or pressure or both to the fluid as it passesthrough the impeller. The fluid velocity is increased through theimpeller, and the stator converts kinetic energy to pressure energy. Theincrease in velocity of the fluid is primarily in the tangentialdirection (swirl) and the stator removes this angular momentum.

Various modifications to the example embodiments will be readilyapparent to those skilled in the art, and the generic principles definedherein may be applied to other embodiments and applications withoutdeparting from the spirit and scope of the invention. Moreover, in thefollowing description, numerous details are set forth for the purpose ofexplanation. However, one of ordinary skill in the art will realize thatthe invention may be practiced without the use of these specificdetails. In other instances, well-known structures and processes areshown in block diagram form in order not to obscure the description ofthe invention with unnecessary detail. Thus, the present disclosure isnot intended to be limited to the embodiments shown, but is to beaccorded the widest scope consistent with the principles and featuresdisclosed herein.

In describing exemplary embodiments, specific terminology is used forthe sake of clarity. For purposes of description, each specific term isintended to at least include all technical and functional equivalentsthat operate in a similar manner to accomplish a similar purpose.Additionally, in some instances where a particular exemplary embodimentincludes a plurality of system elements, device components or methodsteps, those elements, components or steps may be replaced with a singleelement, component or step. Likewise, a single element, component orstep may be replaced with a plurality of elements, components or stepsthat serve the same purpose. Moreover, while exemplary embodiments havebeen shown and described with references to particular embodimentsthereof, those of ordinary skill in the art will understand that varioussubstitutions and alterations in form and detail may be made thereinwithout departing from the scope of the invention. Further still, otherembodiments, functions and advantages are also within the scope of theinvention.

Exemplary flowcharts are provided herein for illustrative purposes andare non-limiting examples of methods. One of ordinary skill in the artwill recognize that exemplary methods may include more or fewer stepsthan those illustrated in the exemplary flowcharts, and that the stepsin the exemplary flowcharts may be performed in a different order thanthe order shown in the illustrative flowcharts.

What is claimed is:
 1. A heat transfer apparatus for a computercomponent, said apparatus comprising: an enclosure formed of an upperhousing stacked on top of and fastened to a lower housing, the enclosurecomprising: a first chamber horizontally offset from a second chamber; apump comprising an impeller disposed within a stator, the impeller andstator disposed within the lower housing of the first chamber; an inletdisposed in a first aperture proximate to a center of the upper housing;an outlet disposed in a second aperture horizontally offset from thecenter of the upper housing, wherein the inlet is in fluid communicationwith the pump in the first chamber and the outlet is in fluidcommunication with the second chamber; and a cold plate fixed to abottom surface of the lower housing and the second chamber, the coldplate configured to transfer heat from an adjacent heat source into thesecond chamber.
 2. The heat transfer apparatus of claim 1, furthercomprising a fan fixture removably secured to the upper housing, the fanfixture comprising a first opening to receive the inlet and a secondopening to receive the outlet and a fan horizontally offset from thefirst opening and the second opening, the fan, when energized circulatesair throughout the immediate environment.
 3. The heat transfer apparatusof claim 1, wherein the impeller comprises impeller blades arrangeduniformly around a top surface of the impeller and extending out from ashaft fixed at a center of the impeller.
 4. The heat transfer apparatusof claim 1, wherein the impeller comprises a magnet ring disposed withinthe inner structure of the impeller such that the impeller is partiallysecured around a shaft within the stator by a magnetic field generatedby the magnetic ring.
 5. The heat transfer apparatus of claim 1, whereinthe second chamber is defined between the lower housing and the coldplate.
 6. The heat transfer apparatus of claim 1, wherein the secondchamber is in fluid communication with the first chamber via a least onepassageway offset from a center of the impeller.
 7. A system for coolinga central processor within a computing device, said system comprising: aheat transfer apparatus comprising: a housing defined by an upperportion stacked upon and fastened to a lower portion to form a firstchamber horizontally offset from a second chamber; a reservoir disposedwithin the first chamber and the second chamber, the reservoircomprising a plurality of channels configured to allow fluidcommunication from the first chamber to the second chamber; a pumpcomprising an impeller disposed within the first chamber defined betweenthe upper portion and the lower portion, the pump further comprising astator disposed directly beneath the first chamber; and a heat exchangeinterface fixed to the housing to define a bottom surface of thehousing, wherein a top surface of the computer processor is coupled toor adjacent to a bottom surface of the heat exchange interface of theheat transfer apparatus.
 8. The system according to claim 7, furthercomprising: an inlet disposed in a first aperture proximate to a centerof the upper portion of the housing, the inlet is in fluid communicationwith the first chamber.
 9. The system according to claim 8, furthercomprising: an outlet disposed in a second aperture offset from thecenter of the upper portion of the housing, the outlet in fluidcommunication with the second chamber.
 10. The system according to claim7, wherein the plurality of channels are offset from a center of theimpeller.
 11. The system according to claim 9, wherein the heat exchangeinterface is configured to absorb heat therein and transfer the heat toa liquid coolant that passes over the heat exchange interface.
 12. Thesystem according to claim 11, wherein the liquid coolant is configuredto absorb the heat and flow through the outlet to a heat dissipatingdevice.
 13. The system according to claim 7, wherein the lower portionseparates the impeller from the stator to isolate the stator from theimpeller.
 14. A method for cooling a heat generating computer component,said method comprising the steps of: receiving a liquid coolant into ahousing; transferring the liquid coolant to a pump comprising animpeller and a stator, wherein the pump is disposed in a first chamberof the housing, the first chamber defined between an upper portion and alower portion of the housing; transferring the liquid coolant from thepump to a second chamber horizontally offset from the first chamber ofthe housing, the second chamber comprising a heat exchange interfaceaffixed to a first bottom surface of the second chamber, wherein thefirst bottom surface substantially defines a second bottom surface ofthe housing; and traversing the liquid coolant over the heat exchanginginterface and out from the second chamber.
 15. The method according toclaim 14, wherein the receiving the liquid coolant further comprisesreceiving the liquid coolant into an inlet of the upper portion of thehousing.
 16. The method according to claim 14, further comprisingtraversing the liquid coolant out from the second chamber through anoutlet of the upper portion of the housing, the outlet in fluidcommunication with the second chamber.
 17. The method according to claim14, further comprising absorbing, at least by the liquid coolant, heatfrom the heat exchange interface to reduce a temperature of the heatexchange interface.
 18. The method according to claim 14, furthercomprising transferring the liquid coolant from the pump to the secondchamber via a plurality of passageways that are offset from a center ofthe impeller.
 19. The method according to claim 16, further comprisingtransferring the liquid coolant to a heat dissipating device in fluidcommunication with the outlet.
 20. The method of claim 14, furthercomprising circulating air throughout the immediate environment of thehousing.